A

absorbers 7.2.4

access control system(ACS) 8.2.12

acid cleaning 8.3.8

acidic&alkaline waste water 8.4.13

acoustical insulation and sound proof door 7.5.35

active vibration isolation 7.4.13

active vibration isolation system 7.4.14

adapter 4.6.2

advanced fetch 7.6.2

after rubbing cleaner 7.7.42

Ag paste 5.4.19

aging process 7.7.56

air pattern 7.1.16

air sampling smoke detector fire alarm system 8.2.5

air shower 7.1.21

air spring 7.4.18

air strainer 8.5.10

air traffic control center(ATCC) 3.3.10

airborne particles 7.1.6

air-borne sound 7.5.16

airlock 7.1.22

all dielectric self-support(ADSS)optical fiber cable 5.3.6

allowance value of vibration 7.4.7

ambient noise 7.5.25

amorphous materials 5.1.6

amorphous silicon 5.1.7

amorphous silicon solar cell 4.7.4

anechoic room 7.5.5

anechoic water tank 7.5.32

anisotropic conductive film(ACF) 4.2.23

anisotropic conductive film(ACF)attach process 7.7.50

anneal 7.7.27

anticorrosive technique 7.7.15

area ratio of window to wall 8.4.7

array process 7.7.34

Asˉ containing waste water 8.4.14

as-built 7.1.13

at-rest 7.1.14

audio and visual device 3.4.9

automated storage and retrieval system(AS/RS) 8.5.29

B

back light unit 4.2.21

background noise 7.5.24

background noise of water tank 7.5.33

bare chip assembly 7.7.4

batching 7.7.64

bay-chase type layout 7.7.96

BeiDou navigation satellite system(CNSS) 3.3.9

benzene generic exhaust 8.4.18

bipolar complementary metal-oxide-semiconductor integrated circuits 4.1.5

black matrix(BM) 4.2.17

bonding 7.7.32

broadcast transmitter 3.4.1

building automation system(BAS) 8.2.17

bulk gas 8.3.12

business process outsourcing(BPO)services 8.5.32

C

cable TV system(CATV) 3.4.6

calculation of structure dynamic response onmicro-vibration controlling 7.4.23

camera tube 4.3.8

capacitor 4.4.4

cathode ray tube(CRT) 4.3.4

cell process 7.7.45

cellular manufacturing 7.7.100

center bundle armoured optical cable 5.3.1 3

centrifugal acceleration test machine 6.0.24

chemical filter 8.5.13

chemical-mechanical planarization 7.7.31

chemical-mechanical polish(CMP) 7.7.30

chemical treatment 7.6.9

chemical vapor deposition(CVD) 7.7.24

chip on board(COB) 7.7.54

chip on film(COF)4.5.6

chip on glass(COG) 7.7.53

clean bench 7.1.24

clean room air blowing 8.5.9

clean room authentication 8.5.27

clean room construction ambient temperature 8.5.1

clean room construction decoration 8.5.4

clean room construction management system 8.5.2

clean room end product protection control system 8.5.3

clean room equipment piping 8.5.14

clean room examination items 8.5.25

clean room lamp 8.2.2

clean room(CR) 7.1.1

clean working area 7.1.20

clean working garment 7.1.25

clean zone 7.1.2

cleaner production 8.4.1

cleaning process 7.7.35

cleanliness 7.1.11

cleanliness class 7.1.12

cleanliness recovery characteristic 7.1.31

climate environmental test 7.7.14

coating unit of optical fiber drawing tower 6.0.17

coil 4.4.6

cold working 7.7.71

collapsing 7.7.80

collection rate 7.6.26

color filter(CF) 4.2.16

color picture tube(CPT) 4.3.6

coloring optical fiber 7.7.88

complementary metal-oxide-semiconductor integrated circuits(CMOSIC) 4.1.4

complete machine aging test 7.7.9

complete machine assembling 7.7.8

complete machine debugging 7.7.10

complete machine manufacture environment 7.7.11

comprehensive energy consumption 8.4.5

computer 3.1.1

computer information system integration 3.6.21

computer integrated manufacturing system(CIMS) 7.7.102

computer network 3.1.8

conceptual system design 3.6.15

connector 4.6.1

contactor 4.6.3

control system of optical fiber drawing tower 6.0.18

conversational system 8.2.15

cooling unit of optical fiber drawing tower 6.0.16

copper clad laminate(CCL) 5.4.10

core ribbon cable 5.3.7

core stranding 7.7.87

corona discharge 7.3.4

Crˉ containing waste water 8.4.10

critical dimension 4.1.15

crucible furnace 5.2.8

crystal growing furnace 6.0.8

crystal materials 5.1.2

cutting 7.7.58

cutting process 7.7.46

D

damper 7.4.17

datebase center disaster recover 3.6.12

deionized water 8.3.2

diffusion 7.7.22

digital cordless telephone 8.2.9

digital video broadcasting(DVB) 3.4.4

direct digit control(DDC)system 8.2.18

disassembling remainders 7.6.24

disassembly 7.6.3

display device 4.2.1

disposal 7.6.5

distribution center warehouse 8.5.28

dopant gas 8.3.17

doping 7.7.23

drawing 7.7.86

drawing tower 6.0.14

driver IC 4.2.22

dry cleaning 7.6.12,7.7.36

dry etching process 7.7.39

dry film photoresist 5.4.7

dynamic settling time 7.4.28

dynamics environment test 7.7.13

E

eco-design of product(ECD) 7.6.31

electric boosting 7.7.69

electro luminescence device(ELD) 4.2.11

electrodialyzer 8.3.10

electromagnetic compatibility(EMC) 7.2.5

electromagnetic environment 7.2.1

electromagnetic interference(EMI) 7.2.6

electromagnetic radiation 7.2.2

electromagnetic shielding 7.2.8

electromagnetic shielding room 7.2.9

electromagnetic susceptibility 7.2.7

electromagnetic(EM)wave anechoic chamber 7.2.3

electron beam process equipment 6.0.5

electron gun 4.3.9

electron tube 4.3.1

electronic ceramics 5.2.9

electronic glass 5.2.1

electronic glass waste water 8.4.8

electronic industrial project 2.0.2

electronic information system room 3.6.11

electronic instrument measurement standard device 3.5.2

electronic measuring instrument 3.5.1

electronic packaging materials 5.4.11

electronic paste 5.4.14

electronic patrol system 8.2.13

electronic system project 2.0.3

electronics assembling preparation 7.7.2

electronics chemical materials 5.4.4

electronics engineering 2.0.1

electrostatic decay time 7.3.17

electrostatic discharge protected area(EPA) 7.3.8

electrostatic discharge sensitive(ESDS) 7.3.6

electrostatic discharge(ESD) 7.3.2

electrostatic discharge(ESD)controlled environment 7.3.27

electrostatic discharge(ESD)grounding system 7.3.22

electrostatic dissipative material 7.3.25

electrostatic grounding 7.3.19

electrostatic grounding resistance 7.3.23

electrostatic half-life 7.3.16

electrostatic harm 7.3.3

electrostatic induction 7.3.9

electrostatic leakage 7.3.10

electrostatic dissipation 7.3.24

electrostatic noise 7.3.7

energy recovery 7.6.17

enviironment test 7.7.12

enviironment vibration 7.4.21

environmental monitoring system 8.2.20

environmental noise 7.5.25

environmental test equipment 6.0.20

environment-friendly use period 7.6.32

epitaxial gas 8.3.15

epitaxy 7.7.16

equipment for clean room 6.0.28

equivalent absorption area 7.5.13

etching 7.7.21

etching gas 8.3.16

exhaust equipment 6.0.4

external storage device 3.1.7

F

Fˉ containing waste water 8.4.11

facility layout 7.7.95

fan filter unit(FFU) 7.1.29

ferroelectric ceramics 5.2.12

fiber ribbon 7.7.89

field emission display(FED) 4.2.9

fire alarm system(FAS) 8.2.11

fire-firing access 8.1.6

flame hydrolyzing process 7.7.85

flat panel displays(FPD) 4.2.2

flexible manufacturing system(FMS) 7.7.103

flexible printed circuit board(FPC) 4.5.4

floating floor 7.5.22

floats law 7.7.75

flow welding machine 6.0.10

fluid bath seal 8.5.12

fluidized bed method 7.7.62

forming 7.7.70

foundation stiffness 7.4.11

free sound field 7.5.4

frequency choke 4.4.7

full oxygen combustion 7.7.67

functional ceramics 5.2.11

fusion overflow process 7.7.74

G

GaAs light coupled device 4.1.10

gas purification 8.3.18

getter 4.3.11

glass furnace 5.2.7

glass insulator 5.2.6

glass shell 5.2.3

glass substrate 4.2.15,5.2.2

global positioning system(GPS) 3.3.4

graphite product 5.4.6

grinding 7.7.72

grinding waste water 8.4.9

ground micro-vibration 8.1.5

group technology 7.7.99

H

hardware 3.1.2

hazardous substance 7.6.25

heating furnace of optical fiber drawing tower 6.0.15

hemi-anechoic room 7.5.6

high efficiency particulate air filter(HEPA) 7.1.26

high purity gas 8.3.14

highly effective filter sealing 8.5.11

high-purity gas piping 8.5.16

high-purity water 8.3.4

high-purity water piping 8.5.15

homogeneous material 7.6.23

humidity chamber 6.0.26

hydroacoustics 7.5.31

hydrometallurgy 7.6.11

I

image converter tube 4.3.13

image intensifier tube 4.3.14

improved siemens method 7.7.60

in circuit tester(ICT) 6.0.19

indicator tube 4.3.7

indirect grounding 7.3.20

indium tin oxide(IT0)conductive film 4.2.20

inductor 4.4.5

information document management 8.5.30

information network construction 3.6.3

information system 3.6.1

infrared detector 4.1.12

inner electrostatic potential 7.3.5

input device 3.1.4

instrument landing system 3.3.7

insulating materials 5.4.1

integrated circuits(IC)4.1.2

integration test 3.6.22

internet 3.6.8

internet data center(IDC) 3.6.9

internet of things 3.6.10

interphone system 8.2.14

ion beam process equipment 6.0.6

ion exchange 8.3.5

ion implant 7.7.26

ionic tube 4.3.15

island layout 7.7.97

isolation platform 7.4.19

J

just-in-time(JIT) 7.7.101

K

KVM centralized operating system 8.2.21

L

laser process equipment 6.0.7

lead breathing 8.4.20

lead glass 5.2.4

lead-free soldering 8.4.3

leakage test 7.1.30

levelling repeatable accuracy 7.4.27

light emitting diode(LED) 4.1.14

liquid crystal displays(LCD) 4.2.3

liquid crystal materials 5.4.3

liquid crystal module(LCM)process 7.7.47

liquid crystal module(LCM) 4.2.14

liquid crystal on silicon(LCOS)display 4.2.12

liquid crystal(LC) 4.2.18

lithium cell 4.7.6

lithium-ion battery 4.7.7

lithography 7.7.20

local area network(LAN) 3.6.4

lock for material 7.7.98

low pressure test chamber 6.0.27

M

magnetic materials 5.4.2

management information system(MIS) 3.6.2

masking 7.7.20

mass law 7.5.19

melting 7.7.66

metal clad board 5.4.9

metal foil clad board 5.4.9

metal stave sheet 8.5.5

metal stave sheet design 8.5.6

metal lization 7.7.28

metal lurgical purifying method 7.7.59

metal-organic chemical vapor deposition(MOCVD)machine 6.0.13

metal-oxide-semiconductor integrated circuits(MOSIC) 4.1.3

metropolitan area network(MAN) 3.6.5

micro-electronics technology 4.1.1

mlcropartiele 7.1.8

microperforated absorber 7.5.15

micro-vibration 7.4.1

micro-vibration control 7.4.2

micro-vibration control system of structure 7.4.22

micro-vibration test and analysis 7.4.25

miicrowave communication 3.2.7

miicrowave landing system(MLS) 3.3.6

miicrowave relay communication link 3.2.8

miicrowave station equipment 3.2.9

miicrowave tube 4.3.3

mmienvironment 7.1.28

mixed airflow 7.1.19

mobile communication equipment 3.2.1

mobile multimedia broadcasting 3.4.7

modal structure calculation 7.4.24

mode of vibration 7.4.6

mode shape 7.4.3

modified chemical vapour deposition(MCVD) 7.7.78

modified recycling 7.6.19

molecular-beam epitaxy(MBE) 7.7.18

muffler 7.5.30

multi-function anechoic room 7.5.7

multi-mode fiber 5.3.4

mutilayer printed board 4.5.3

N

nano-materials 5.4.16

natural frequency 7.4.12

navigation 3.3.2

navigation system 3.3.3

no-clean for PCB assemblies 7.7.6

noise 7.5.23

noise reduction coefficient(NRC) 7.5.12

non-ozone depleting substances 8.4.2

non-unidirectional airflow 7.1.18

O

octave bandwidth 7.5.29

one drop filling process(ODF) 7.7.55

operational 7.1.15

optical fiber 5.3.1

optical fiber cable 5.3.2

optical fiber communication 3.2.6

optical fiber ground wire(OPGW) 5.3.8

optical fiber preform 5.3.5

optoelectronic materials 5.4.12

organic light-emitting display(OLED) 4.2.8

organic waste water 8.4.12

output device 3.1.5

outside vapour deposition(OVD) 7.7.76

overall performance evaluation 8.5.26

overcladding 7.7.81

oxidation 7.7.19

oxygen-enriched combustion 7.7.68

oxygen-free copper 5.4.8

P

packaging 7.7.33

panel alignment process 7.7.44

panel cleaning process 7.7.48

parking management system 8.2.16

partical size 7.1.5

particle concentration 7.1.10

particle density test 8.5.24

particle size distribution 7.1.9

passbox 7.1.23

passivation 7.7.29

passive vibration isolation 7.4.15

PCB assembling 7.7.3

phosphor 5.4.13

photocell 4.1.13

photolithography 7.7.20

phototransistor 4.1.11

phototube 4.3.12

photovoltaic 4.7.1

physical treatment 7.6.8

piezoelectric materials 5.4.17

pink noise 7.5.28

pipeline blowing 8.5.21

pipeline for chemicals 8.5.17

pipeline purity test 8.5.22

piping system cleaning 8.5.19

piping system hermeticness examination 8.5.20

plasma activated chemical vapour deposition(PCVD) 7.7.79

plasma display panel(PDP) 4.2.7

plasma enhanced chemical vapor deposition(PECVD)machine 6.0.12

plasma enhanced chemical vapor deposition(PECVD) 7.7.37

plasma spray 7.7.83

pneumatic conveying 7.7.65

point of use treatment 8.4.21

polarizer 4.2.19

polaroid attach 7.7.49

polishing 7.7.73

polycrystal semiconductor materials 5.1.4

polyimide direction coater process 7.7.40

polysilicon 5.1.5

post-treatment system 8.3.6

potentiometer 4.4.3

power spectral density 7.4.9

precision air conditioning 8.2.6

premises distributed system(PDS) 8.2.19

printed board assembly 4.5.2

printed circuit board(PCB)4.5.1

printed electronics 4.5.5

process design 7.7.93

process requirements 7.7.94

process water 8.3.1

projection tube 4.3.5

pure water 8.3.3

purification air-conditioning system 8.5.7

purification air-conditioning system testing 8.5.8

pyrolysis 7.6.7

pyrometallurgy 7.6.10

Q

quartz product 5.4.5

R

radar 3.3.1

radioactive materials 5.4.18

random noise 7.5.26

ratio of damping 7.4.10

reclaimed water 8.4.15

recoverability rate 7.6.30

recovery 7.6.21

recovery rate 7.6.28

recyclability marking of the product 7.6.15

recyclability rate 7.6.29

recycled material 7.6.22

recycling 7.6.20

recycling directly 7.6.18

recycling rate 7.6.27

regeneration 8.3.7

relay 4.6.5

resistance to earth 7.3.15

resistor 4.4.1

reusable components 7.6.16

reuse 7.6.14

reverse osmosis unit(RO) 8.3.11

rod in tube(RID) 7.7.82

room absorption 7.5.14

room acoustics 7.5.9

room for cleaning human body 7.1.3

room for cleaning material 7.1.4

rubbing process 7.7.41

S

satellite communication 3.2.3

satellite communication earth station 3.2.5

satellite communication equipment 3.2.4

satellite navigation system 3.3.8

satellite TV programs 3.4.8

screen printing 7.7.57

seal agent 5.4.20

seal material coating process 7.7.43

secondary coating 7.7.90

selection by classification 7.6.6

selection of components by aging method 7.7.1

self-cleaning time 7.1.31

semi-anechoic room 7.5.6

semiconductor materials 5.1.1

semiconductor photoelectronic device 4.1.9

semiconductor rectifier 4.1.6

sensitive resistor 4.4.2

shadow mask 4.3.10

shaker 6.0.21

shape coefficient 8.4.6

shielding effectiveness 7.2.10

shock test machine 6.0.22

silane method 7.7.61

silencer 7.5.30

silicon controlled rectifier(SCR) 4.1.8

silicon solar eell 4.7.3

silicon vapor-phase epitaxy(VPE) 7.7.17

silicon-based materials 5.1.8

silicon-on-insulator(SOI) 5.1.9

single crystal materials 5.1.3

single-mode fiber 5.3.3

slicing machine 6.0.9

soft grounding 7.3.21

software 3.1.3

software park 8.5.31

software park innovation centre 8.5.33

solar cell 4.7.2

sol-gel 7.7.84

solid-borne sound 7.5.17

sound absorption coefficient 7.5.10

sound absorption material 7.5.11

sound bridge 7.5.20

sound broadcasting system 8.2.10

sound control room 7.5.8

sound field 7.5.3

sound intensity 7.5.2sound lock 7.5.21

sound pressure 7.5.1

sound reduction index 7.5.18

special gas 8.3.13

specification 3.6.13

spectrum analysis 7.4.8

spiral space tube cable 5.3.11

sputtering 7.7.25

sputtering equipment 6.0.3

static conductive material 7.3.26

static electricity 7.3.1

steel wire central tube stranded cabling 7.7.92

stem 5.2.5

storage 3.1.6

stranded loose tube cable 5.3.10

stranded loose tube cabling 7.7.91

structural ceramics 5.2.10

structural ground floor 8.1.3

structure micro-vibration control system 7.4.22

submarine optical fiber cable 5.3.9

super twisted nematic LCD(STN-LCD) 4.2.5

superconducting materials 5.4.15

surface mounted devices(SMD) 4.4.8

surface mounted technology(SMT) 7.7.5

surface mounted technology(SMT)machine 6.0.11

surface resistance 7.3.11

surface resistivity 7.3.13

switch 4.6.4

system design 3.6.14

system design specification(SDS) 3.6.17

system detail design 3.6.16

system interface 3.6.18

system interface specification(SIS) 3.6.19

system test plan(STP) 3.6.20

T

tactical air navigation(TACAN)system 3.3.5

tape automated bonding(TAB) 7.7.52

tape carrier package(TCP) 4.5.7

tape carrier packaging(TCP)assembly 7.7.51

technical mezzanine 7.1.32

technical shaft 7.1.34

technical tunnel 7.1.33

telecom system 8.2.7

television pick-up tube 4.3.8

temperature test chamber 6.0.25

test for PCB 7.7.7

the integration of telecommunication networks,cable TV networks and the internet 3.6.23

thin film solar cell 4.7.5

thin-film transistors LCD(TFT-LCD) 4.2.6

tight tube cable 5.3.12

touch panel 4.2.13

traffic simulator 6.0.23

transistor 4.1.7

treatment 7.6.4

triboelectric voltage 7.3.18

trunked mobile communication system 3.2.2

TV broadcast by satellite(TVBS) 3.4.5

TV-transmitter 3.4.2

TV-transposer 3.4.3

twisted nematic LCD(TN-LCD) 4.2.4

U

ultra low penetration air filter(ULPA) 7.1.27

ultrafilter(UF) 8.3.9

ultrafine particle 7.1.7

unidirectional airflow 7.1.17

uninterruptible power system(UPS) 8.2.3

V

vacuum coating equipment 6.0.2

vacuum electronic device 4.3.2

vacuum equipment 6.0.1

vacuum fluorescent display(VFD) 4.2.10

vapor to liquid deposition(VLD) 7.7.63

vapor axial deposition(VAD) 7.7.77

venomous exhaust 8.4.19

vibration amplitude 7.4.5

vibration attenuation of the ground 7.4.26

vibration frequency 7.4.4

vibration isolation joint 8.1.4

vibration isolation support 8.5.18

vibration isolator 7.4.16

vibration resistance wall 8.1.2

vibration transmissibility 7.4.20

video conference system 8.2.8

volatile organic compounds exhaust 8.4.17

volatile organic compounds(VOC) 8.4.16

volume resistance 7.3.12

volume resistivity 7.3.14

W

wafer 4.1.16

waffle slab 8.1.1

waste electrical and electronic products 7.6.1

water content(dew point)test 8.5.23

water reuse rate 8.4.4

wave filter 8.2.4

wedge absorber 7.5.34

wet cleaning 7.6.13

wet etching process 7.7.38

white noise 7.5.27

wide area network(WAN) 3.6.6

wireless LAN(WLAN) 3.6.7

X

X-ray tube 4.3.16

Y

yellow light area 8.2.1